{"id":2,"date":"2015-11-15T04:02:58","date_gmt":"2015-11-15T04:02:58","guid":{"rendered":"http:\/\/sites.ieee.org\/sagroups-template\/?page_id=2"},"modified":"2025-03-18T13:53:55","modified_gmt":"2025-03-18T17:53:55","slug":"home","status":"publish","type":"page","link":"https:\/\/sagroups.ieee.org\/3537\/","title":{"rendered":"IEEE P3537 3Dblox&#8211; Chiplet Connectivity and Physical Properties Description Language"},"content":{"rendered":"<p><b>Title: <\/b>Standard for 3Dblox&#8211;Chiplet Connectivity and Physical Properties Description Language<\/p>\n<p><b>Scope: <\/b>This standard defines a modular hierarchical language syntax, rules, and usage model to represent a high-level description of the components and connectivity between various components (including chiplets, interposers, substrates, etc.) in 2.5D\/3D advanced packaging technologies. This description language enhances the 3Dblox description language. For each component, a high-level description includes size, orientation, interface, thickness, interconnect regions, interconnect structures, and other physical properties required for integration in a 2.5D\/3D stack. The features of this description language are designed to serve chiplet makers, 2.5D\/3D packagers, and end users.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Title: Standard for 3Dblox&#8211;Chiplet Connectivity and Physical Properties Description Language Scope: This standard defines a modular hierarchical language syntax, rules, and usage model to represent a high-level description of the [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/pages\/2","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/comments?post=2"}],"version-history":[{"count":0,"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/pages\/2\/revisions"}],"wp:attachment":[{"href":"https:\/\/sagroups.ieee.org\/3537\/wp-json\/wp\/v2\/media?parent=2"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}